HKFIA Supports the 2026 Shenzhen-Hong Kong Financial Innovation Competition (Hong Kong Division)

The Hong Kong Fintech Industry Association (HKFIA) is pleased to support the 2026 Shenzhen-Hong Kong Financial Innovation Competition (Hong Kong Division) and encourages eligible financial institutions, technology companies and FinTech innovators to participate.

Jointly organised by the Financial Services and the Treasury Bureau (FSTB) of the HKSAR Government and relevant financial regulatory authorities in Shenzhen, with Cyberport serving as the organiser of the Hong Kong Division, the Competition aims to promote financial innovation collaboration between Shenzhen and Hong Kong, facilitate the exchange of outstanding projects and strengthen the cross-boundary financial ecosystem.

The Competition provides a valuable opportunity for participants to showcase innovative solutions, demonstrate real-world impact and contribute to the continued development of financial innovation across Hong Kong and Shenzhen.

Four Competition Tracks

Each project may enter one of the following tracks:

• TechFin, including Wealth Management & Capital Markets

• Inclusive Finance, including Green Finance

• FinTech

• Shenzhen-Hong Kong Financial Connect

Projects will be assessed based on four key areas: innovation, practical value and impact, demonstration effect, and risk management and security.

Who Can Participate?

The Hong Kong Division is open to:

• Licensed financial institutions in Hong Kong;

• Technology companies registered in Hong Kong that primarily serve the financial industry; and

• Lead entities of Shenzhen-Hong Kong financial or FinTech collaboration projects.

The Competition adopts a structure of separate preliminary rounds in Shenzhen and Hong Kong, followed by a joint final round, providing selected projects with broader exposure across the Shenzhen-Hong Kong financial innovation ecosystem.

Application Details

Registration deadline: 31 August 2026

Interested applicants should create an account on the official platform by 31 August 2026. Project information and application materials may be completed and submitted by mid-September.

Competition details (Simplified Chinese only):https://bit.ly/4x9oABo

Online application:https://szfic.szfta.org.cn/register

For enquiries, please contact the Cyberport Shenzhen-Hong Kong Financial Innovation Competition (Hong Kong Division) Project Team at fintech@cyberport.hk.

HKFIA encourages our members and the wider FinTech community to take part and showcase Hong Kong’s innovation capabilities while contributing to deeper financial collaboration between Hong Kong and Shenzhen.